US Patent Issued to Amkor Technology Singapore Holding on Aug. 11 for "Semiconductor package and manufacturing method thereof" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,007, issued on Aug. 11, was assigned to Amkor Technology Singapore Holding Pte Ltd. (Singapore).

"Semiconductor package and manufacturing method thereof" was invented by Jae Ung Lee (Seoul, South Korea), Yung Woo Lee (Anyang-si, South Korea), EunNaRa Cho (Seoul, South Korea), Dong Hyun Bang (Seoul, South Korea), Wook Choi (Seoul, South Korea), KooWoong Jeong (Seoul, South Korea), Byong Jin Kim (Bucheon-si, South Korea), Min Chul Shin (Bucheon-si, South Korea), Ho Jeong Lim (Seoul, South Korea), Ji Hyun Kim (Seoul, South Korea) and Chang Hun Kim (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package and a method of...