US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 11 for "Semiconductor device, package structure and method of fabricating the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,011, issued on Aug. 11, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor device, package structure and method of fabricating the same" was invented by Tsung-Fu Tsai (Changhua County, Taiwan), Ying-Ching Shih (Hsinchu City, Taiwan) and Szu-Wei Lu (Hsinchu City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure includes a semiconductor die, a first insulating encapsulant, a plurality of first conductive features, an interconnect structure and bump structures. The semiconductor die includes a plurality of conductive pillars made of a first material. The first insulating encapsulant is...