US Patent Issued to SAMSUNG ELECTRONICS on Aug. 11 for "Semiconductor package having first pad and second pad" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,010, issued on Aug. 11, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Semiconductor package having first pad and second pad" was invented by Juhyeon Kim (Suwon-si, South Korea), Yeongseon Kim (Suwon-si, South Korea), Sunkyoung Seo (Suwon-si, South Korea) and Chajea Jo (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a first semiconductor chip stacked on a second semiconductor chip. The first semiconductor chip includes a first substrate, a first insulating layer on a lower surface of the first substrate, and a first pad exposed through the first insulating layer. The seco...