US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 11 for "Semiconductor device structure having a multi-layer conductive feature and method making the same" (Taiwanese Inventors)

Posted On: 2026-08-12

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,965, issued on Aug. 11, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING Co. LTD. (Hsinchu, Taiwan). "Semiconductor device structure havi... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 11 for "Semiconductor device" (Taiwanese Inventors)

Posted On: 2026-08-12

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ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,966, issued on Aug. 11, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor device" was invented ... Read More

US Patent Issued to Micron Technology on Aug. 11 for "Semiconductor device assemblies including monolithic silicon structures for thermal dissipation and methods of making the same" (Idaho Inventor)

Posted On: 2026-08-12

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ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,967, issued on Aug. 11, was assigned to Micron Technology Inc. (Boise, Idaho). "Semiconductor device assemblies including monolithic silico... Read More

US Patent Issued to INVENTION AND COLLABORATION LABORATORY on Aug. 11 for "Heat removing layer surrounding a transistor" (Taiwanese Inventors)

Posted On: 2026-08-12

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ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,968, issued on Aug. 11, was assigned to INVENTION AND COLLABORATION LABORATORY INC. (Taipei City, Taiwan). "Heat removing layer surrounding... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 11 for "Manufacturing method of semiconductor package including cutting heat dissipation sheet into a plurality of heat dissipation films" (Taiwanese Inventors)

Posted On: 2026-08-12

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ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,969, issued on Aug. 11, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Manufacturing method of semiconduct... Read More

US Patent Issued to DENSO on Aug. 11 for "Semiconductor device having metal member with bonding member receiving space" (Japanese Inventors)

Posted On: 2026-08-12

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ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,970, issued on Aug. 11, was assigned to DENSO Corp. (Kariya-city, Japan). "Semiconductor device having metal member with bonding member rec... Read More

US Patent Issued to Intel on Aug. 11 for "Transistor-scale thermoelectric devices for refrigeration of integrated circuits" (Oregon Inventors)

Posted On: 2026-08-12

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ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,971, issued on Aug. 11, was assigned to Intel Corp. (Santa Clara, Calif.). "Transistor-scale thermoelectric devices for refrigeration of in... Read More

US Patent Issued to Microsoft Technology Licensing on Aug. 11 for "Heterogeneously integrated liquid electrolyte powered processor" (Washington Inventors)

Posted On: 2026-08-12

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ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,972, issued on Aug. 11, was assigned to Microsoft Technology Licensing LLC (Redmond, Wash.). "Heterogeneously integrated liquid electrolyte... Read More

US Patent Issued to Industrial Technology Research Institute on Aug. 11 for "Power module" (Taiwanese Inventors)

Posted On: 2026-08-12

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ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,973, issued on Aug. 11, was assigned to Industrial Technology Research Institute (Hsinchu, Taiwan). "Power module" was invented by Shian-Ch... Read More

US Patent Issued to Infineon Technologies Austria on Aug. 11 for "Semiconductor package with a scratch protection layer and method of fabrication" (German Inventors)

Posted On: 2026-08-12

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ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,974, issued on Aug. 11, was assigned to Infineon Technologies Austria AG (Villach, Austria). "Semiconductor package with a scratch protecti... Read More

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US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 11 for "Semiconductor device structure having a multi-layer conductive feature and method making the same" (Taiwanese Inventors)

US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 11 for "Semiconductor device" (Taiwanese Inventors)

US Patent Issued to Micron Technology on Aug. 11 for "Semiconductor device assemblies including monolithic silicon structures for thermal dissipation and methods of making the same" (Idaho Inventor)

US Patent Issued to INVENTION AND COLLABORATION LABORATORY on Aug. 11 for "Heat removing layer surrounding a transistor" (Taiwanese Inventors)

US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 11 for "Manufacturing method of semiconductor package including cutting heat dissipation sheet into a plurality of heat dissipation films" (Taiwanese Inventors)

US Patent Issued to DENSO on Aug. 11 for "Semiconductor device having metal member with bonding member receiving space" (Japanese Inventors)

US Patent Issued to Intel on Aug. 11 for "Transistor-scale thermoelectric devices for refrigeration of integrated circuits" (Oregon Inventors)

US Patent Issued to Microsoft Technology Licensing on Aug. 11 for "Heterogeneously integrated liquid electrolyte powered processor" (Washington Inventors)

US Patent Issued to Industrial Technology Research Institute on Aug. 11 for "Power module" (Taiwanese Inventors)

US Patent Issued to Infineon Technologies Austria on Aug. 11 for "Semiconductor package with a scratch protection layer and method of fabrication" (German Inventors)