ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,934, issued on Aug. 11, was assigned to Tianma Advanced Display Technology Institute (Xiamen) Co. Ltd. (Xiamen, China). "Microdevice substr... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,935, issued on Aug. 11, was assigned to WUHAN XINXIN SEMICONDUCTOR MANUFACTURING Co. LTD. (Wuhan, China). "Chip bonding method" was invente... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,936, issued on Aug. 11, was assigned to Tokyo Electron Ltd. (Tokyo). "Substrate processing method and substrate processing apparatus" was i... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,937, issued on Aug. 11, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Wafer release mechanism" was invent... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,938, issued on Aug. 11, was assigned to ASM IP Holding B.V. (Almere, Netherlands). "Susceptor for semiconductor substrate processing" was i... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,939, issued on Aug. 11, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Substrate holder systems" was invented by Chenfei Hu... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,940, issued on Aug. 11, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Defect inspection system employing ... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,941, issued on Aug. 11, was assigned to Adeia Semiconductor Bonding Technologies Inc. (San Jose, Calif.). "Bonding surface validation on di... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,942, issued on Aug. 11, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor device" was invented by Yongho... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,943, issued on Aug. 11, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Method for semiconductor patterning using io... Read More