ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,935, issued on Aug. 11, was assigned to WUHAN XINXIN SEMICONDUCTOR MANUFACTURING Co. LTD. (Wuhan, China).
"Chip bonding method" was invented by Wanli Guo (Wuhan, China) and Tianjian Liu (Wuhan, China).
According to the abstract* released by the U.S. Patent & Trademark Office: "A die bonding method includes temporarily bonding a first carrier wafer to a front side of a device wafer, so that a back-side connection structure can be formed on a back side of the device wafer to lead out an interconnect structure in the device wafer to the back side of the device wafer. Moreover, through bonding a second carrier wafer to the back side of the device wafer, the first carrier wafer can be...