ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,649, issued on Aug. 11, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Stacked 3D cache configuration with on-chip ... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,650, issued on Aug. 11, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Package structure and method fo... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,651, issued on Aug. 11, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Hybrid memory device and electronic devic... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,652, issued on Aug. 11, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan) and NATIONAL YANG MING.CHIAO TUNG ... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,653, issued on Aug. 11, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Thick redistribution layer feat... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,654, issued on Aug. 11, was assigned to Intel Corp. (Santa Clara, Calif.). "Technologies for low-leakage on-chip capacitors" was invented b... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,655, issued on Aug. 11, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Structure and method for deep t... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,656, issued on Aug. 11, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Co-integration of gate-all-around nanosheet ... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,657, issued on Aug. 11, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Thin film resistor" was invente... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,658, issued on Aug. 11, was assigned to Panasonic Intellectual Property Management Co. Ltd. (Osaka, Japan). "Method for manufacturing capac... Read More