US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 11 for "Package structure and method for forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,650, issued on Aug. 11, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Package structure and method for forming the same" was invented by Chen-Hua Yu (Hsinchu City, Taiwan), Tung-Liang Shao (Hsinchu City, Taiwan) and Yu-Sheng Huang (Changhua County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure is provided. The package structure includes a cell chip structure having a memory cell and a multiplexer. The package structure includes an intermediate chip structure directly bonded to the cell chip structure through dielectric-to-dielectric bonding and metal-to-metal bonding and having a sens...