ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,649, issued on Aug. 11, was assigned to International Business Machines Corp. (Armonk, N.Y.).
"Stacked 3D cache configuration with on-chip power support" was invented by Arvind Kumar (Chappaqua, N.Y.), Todd Edward Takken (Brewster, N.Y.), John W Golz (Hopewell Jct, N.Y.) and Joshua M. Rubin (Albany, N.Y.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor module includes a first semiconductor die, which comprises (i) a power support structure and (ii) a first cache region; and a second semiconductor die, which is mounted on top of the first semiconductor die and comprises (i) a logic core, which overlies and is electrically connected to t...