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US Patent Issued to NANYA TECHNOLOGY on Aug. 25 for "Contact structure, semiconductor device with the same, and method for fabricating the same" (Taiwanese Inventor)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,139, issued on Aug. 25, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Contact structure, semiconductor device with the... Read More


US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 25 for "Semiconductor device structure and methods of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,140, issued on Aug. 25, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Semiconductor device structure ... Read More


US Patent Issued to Renesas Electronics on Aug. 25 for "Semiconductor device and method of manufacturing the same" (Japanese Inventor)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,141, issued on Aug. 25, was assigned to Renesas Electronics Corp. (Tokyo). "Semiconductor device and method of manufacturing the same" was ... Read More


US Patent Issued to INTERNATIONAL BUSINESS MACHINES on Aug. 25 for "Isolated super via to middle metal line level" (New York Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,142, issued on Aug. 25, was assigned to INTERNATIONAL BUSINESS MACHINES Corp. (Armonk, N.Y.). "Isolated super via to middle metal line leve... Read More


US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 25 for "Hybrid method for forming semiconductor interconnect structure" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,143, issued on Aug. 25, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING Co. LTD (Hsinchu, Taiwan). "Hybrid method for forming semiconduc... Read More


US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 25 for "Semiconductor device with polygonal inductive device" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,144, issued on Aug. 25, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Semiconductor device with polyg... Read More


US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 25 for "Semiconductor device and method for forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,145, issued on Aug. 25, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Semiconductor device and method... Read More


US Patent Issued to NANYA TECHNOLOGY on Aug. 25 for "Semiconductor device and method of manufacturing the same" (Taiwanese Inventor)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,146, issued on Aug. 25, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Semiconductor device and method of manufacturing... Read More


US Patent Issued to International Business Machines on Aug. 25 for "Direct backside contact with replacement backside dielectric" (New York Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,147, issued on Aug. 25, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Direct backside contact with replacement bac... Read More


US Patent Issued to INTERNATIONAL BUSINESS MACHINES on Aug. 25 for "Semiconductor device with power supply distribution networks on frontside and backside of a circuit" (New York, New Hampshire, Vermont Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,148, issued on Aug. 25, was assigned to INTERNATIONAL BUSINESS MACHINES Corp. (Armonk, N.Y.). "Semiconductor device with power supply distr... Read More