US Patent Issued to INTERNATIONAL BUSINESS MACHINES on Aug. 25 for "Isolated super via to middle metal line level" (New York Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,142, issued on Aug. 25, was assigned to INTERNATIONAL BUSINESS MACHINES Corp. (Armonk, N.Y.).

"Isolated super via to middle metal line level" was invented by Koichi Motoyama (Clifton Park, N.Y.), Ruilong Xie (Niskayuna, N.Y.) and Nicholas Anthony Lanzillo (Wynantskill, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "One or more systems, devices, and/or methods of fabrication provided herein relate to isolated self-aligned super vias. According to one embodiment, a super via device can comprise a super via structure, a metallic line and a dielectric fill material located between the sidewalls of the super via structure and the metallic line."

Th...