ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,729,432, issued on Sept. 8, was assigned to AUO Corp. (Hsinchu, Taiwan). "Semiconductor device and manufacturing method thereof" was invented b... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,729,433, issued on Sept. 8, was assigned to Tokyo Electron Ltd. (Tokyo). "Precoat method for substrate processing apparatus and substrate proce... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,729,434, issued on Sept. 8, was assigned to ASM IP Holding B.V. (Almere, Netherlands). "Method for filling a gap in a three-dimensional structu... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,729,435, issued on Sept. 8, was assigned to ASM IP Holding B.V. (Almere, Netherlands). "Methods for depositing gap-filling fluids and related s... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,729,436, issued on Sept. 8, was assigned to Tokyo Electron Ltd. (Tokyo). "Gas supply amount calculation method and semiconductor device manufac... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,729,437, issued on Sept. 8, was assigned to ASM IP Holding B.V. (Almere, Netherlands). "Method and system for depositing boron nitride using pu... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,729,438, issued on Sept. 8, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Process chamber gas supply improvement" was invented... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,729,439, issued on Sept. 8, was assigned to Rodenstock GmbH (Germany). "Method for operating a coating system for producing layer systems" was ... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,729,440, issued on Sept. 8, was assigned to Tokyo Electron Ltd. (Tokyo). "Plasma processing apparatus and plasma processing method" was invente... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,729,441, issued on Sept. 8, was assigned to SILTRONIC AG (Munich). "Method and device for depositing an epitaxial layer on a substrate wafer ma... Read More