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US Patent Issued to Tokyo Electron on Sept. 8 for "Substrate processing method and plasma processing apparatus" (Japanese, American Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,731,764, issued on Sept. 8, was assigned to Tokyo Electron Ltd. (Tokyo). "Substrate processing method and plasma processing apparatus" was inve... Read More


US Patent Issued to Tokyo Electron on Sept. 8 for "Substrate processing method and substrate processing apparatus" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,731,765, issued on Sept. 8, was assigned to Tokyo Electron Ltd. (Tokyo). "Substrate processing method and substrate processing apparatus" was i... Read More


US Patent Issued to BEIJING NAURA MICROELECTRONICS EQUIPMENT on Sept. 8 for "Substrate support including multiple radio frequency (RF) electrodes" (Chinese Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,731,766, issued on Sept. 8, was assigned to BEIJING NAURA MICROELECTRONICS EQUIPMENT Co. LTD. (Beijing). "Substrate support including multiple ... Read More


US Patent Issued to Applied Materials on Sept. 8 for "Chucking status detection with chucking sensor normalized figure of merit and active chucking voltage control" (California Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,731,767, issued on Sept. 8, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Chucking status detection with chucking sensor norma... Read More


US Patent Issued to HITACHI HIGH-TECH on Sept. 8 for "Plasma processing apparatus" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,731,768, issued on Sept. 8, was assigned to HITACHI HIGH-TECH Corp. (Tokyo). "Plasma processing apparatus" was invented by Yuki Tanaka (Tokyo),... Read More


US Patent Issued to Applied Materials on Sept. 8 for "Higher pressure purge for impurity reduction in radical treatment chamber" (Indian, American Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,731,769, issued on Sept. 8, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Higher pressure purge for impurity reduction in radi... Read More


US Patent Issued to SAMSUNG ELECTRONICS, Korea Institute of Machinery & Materials on Sept. 8 for "Scrubber, substrate processing system including the same, and substrate processing method using the same" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,731,770, issued on Sept. 8, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea) and Korea Institute of Machinery & Materials (D... Read More


US Patent Issued to Applied Materials on Sept. 8 for "Lower deposition chamber CCP electrode cleaning solution" (American, Indian Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,731,771, issued on Sept. 8, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Lower deposition chamber CCP electrode cleaning solu... Read More


US Patent Issued to Tokyo Electron on Sept. 8 for "Plasma measuring method and plasma processing apparatus" (Japanese Inventor)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,731,772, issued on Sept. 8, was assigned to Tokyo Electron Ltd. (Tokyo). "Plasma measuring method and plasma processing apparatus" was invented... Read More


US Patent Issued to Micromass UK on Sept. 8 for "User interface for ion mobility separation device" (British Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,731,773, issued on Sept. 8, was assigned to Micromass UK Ltd. (Wilmslow, Great Britain). "User interface for ion mobility separation device" wa... Read More