ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,731,766, issued on Sept. 8, was assigned to BEIJING NAURA MICROELECTRONICS EQUIPMENT Co. LTD. (Beijing).

"Substrate support including multiple radio frequency (RF) electrodes" was invented by Yulin Peng (Beijing) and Jinrong Zhao (Beijing).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure generally relates to plasma semiconductor processing and processing tools for such processing. A processing tool includes a chamber and a substrate support. The substrate support is disposed inside the chamber. The substrate support includes a support surface configured to support a semiconductor substrate inside the chamber. The substrate support in...