ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,528, issued on Sept. 8, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan). "Manufacturing method for semiconductor device" was inven... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,529, issued on Sept. 8, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Bump structure and method of ma... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,530, issued on Sept. 8, was assigned to Nippon Micrometal Corp. (Saitama, Japan). "Bonding wire for semiconductor devices" was invented by ... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,531, issued on Sept. 8, was assigned to Atotech Deutschland Gmbh & Co. KG (Berlin). "Method for copper-to-copper direct bonding and assembl... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,532, issued on Sept. 8. "Method for manufacturing semiconductor device" was invented by Hiroaki Matsubara (Tokyo), Daisuke Ikeda (Tokyo), S... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,533, issued on Sept. 8, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Integrated circuit package and meth... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,534, issued on Sept. 8, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor structure and manufac... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,535, issued on Sept. 8, was assigned to Amkor Technology Singapore Holding Pte. Ltd. (Singapore). "Electronic devices having embedded modul... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,536, issued on Sept. 8, was assigned to DENSO Corp. (Kariya-city, Japan). "Element package and semiconductor device" was invented by Yoshih... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,537, issued on Sept. 8, was assigned to NXP USA INC. (Austin, Texas). "Two-part molding of device packages with spacers" was invented by An... Read More