US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Sept. 8 for "Bump structure and method of making the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,529, issued on Sept. 8, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Bump structure and method of making the same" was invented by Bo-Yu Chiu (Taoyuan City, Taiwan), Pei-Wei Lee (Pingtung County, Taiwan), Fu Wei Liu (Tainan, Taiwan), Yun-Chung Wu (Taipei City, Taiwan), Hao Chun Yang (New Taipei City, Taiwan), Chin-Yu Ku (Hsinchu City, Taiwan), Ming-Da Cheng (Taoyuan, Taiwan) and Mirng-Ji Lii (Sinpu Township, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a substrate, one or more wiring layers disposed over the substrate, a passivation layer disposed over the one or more wi...