US Patent Issued to DENSO on Sept. 8 for "Element package and semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,536, issued on Sept. 8, was assigned to DENSO Corp. (Kariya-city, Japan).

"Element package and semiconductor device" was invented by Yoshihiro Inutsuka (Kariya-city, Japan), Takahiro Nakano (Kariya-city, Japan), Masayuki Takenaka (Kariya-city, Japan), Naohito Mizuno (Kariya-city, Japan), Seigo Osawa (Kariya-city, Japan) and Yasushi Okura (Kariya-city, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An element package includes a semiconductor element, a redistribution layer, a sealing resin body, and an insulating portion. The semiconductor element includes a semiconductor substrate having an element region and a scribe region, a main electrode ...