ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,531, issued on Sept. 8, was assigned to Atotech Deutschland Gmbh & Co. KG (Berlin).
"Method for copper-to-copper direct bonding and assembly" was invented by Ralf Schmidt (Berlin).
According to the abstract* released by the U.S. Patent & Trademark Office: "The invention relates to method for copper-to-copper direct bonding comprising the steps: a) providing a first substrate comprising a first pure copper deposit having a bonding surface; b) providing a second substrate comprising a second pure copper deposit having a bonding surface; c) connecting the bonding surface of the first deposit with the bonding surface of the second deposit and obtaining a connected deposit; and d) con...