ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,518, issued on Sept. 8, was assigned to DAEDUCK ELECTRONICS Co. LTD. (Gyeonggi-Do, South Korea). "Circuit board and manufacturing method th... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,519, issued on Sept. 8, was assigned to Qorvo US Inc. (Greensboro, N.C.). "Multichip module thermal management through backside metal" was ... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,520, issued on Sept. 8, was assigned to DENSO Corp. (Kariya-city, Japan), TOYOTA JIDOSHA K.K. (Toyota, Japan) and MIRISE Technologies Corp. ... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,521, issued on Sept. 8, was assigned to STMicroelectronics (Grenoble 2) SAS (Grenoble, France). "Electronic device with thermally coupled c... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,522, issued on Sept. 8, was assigned to Amkor Technology Singapore Holding Pte. Ltd. (Singapore). "Semiconductor devices methods of manufac... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,523, issued on Sept. 8, was assigned to InnoLux Corp. (Miao-Li County, Taiwan). "Electronic device and manufacturing method thereof" was in... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,524, issued on Sept. 8, was assigned to Advanced Semiconductor Engineering Inc. (Kaohsiung, Taiwan). "Electronic device" was invented by Ch... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,525, issued on Sept. 8, was assigned to Intel Corp. (Santa Clara, Calif.). "Build up material architecture for microelectronic package devi... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,526, issued on Sept. 8, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor device and method" wa... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,527, issued on Sept. 8, was assigned to JMJ Korea Co. Ltd. (Busan, South Korea). "Apparatus for bonding clip, method of bonding clip, and s... Read More