ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,518, issued on Sept. 8, was assigned to DAEDUCK ELECTRONICS Co. LTD. (Gyeonggi-Do, South Korea).
"Circuit board and manufacturing method thereof" was invented by Seon-Kyu Chang (Seoul, South Korea), Hee-Il Ryu (Gyeonggi-do, South Korea), Hyang-Joo Kim (Ansan-si, South Korea) and Han-Sung Lee (Siheung-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention is characterized by fabricating a cavity in the package substrate and embedding an interconnection device in the cavity, so that the height level of the upper copper bump of the interconnection device is aligned with that of the copper bump of the outer layer of the cir...