US Patent Issued to JMJ Korea on Sept. 8 for "Apparatus for bonding clip, method of bonding clip, and semiconductor package including semiconductor chip to which clip is bonded using the method" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,527, issued on Sept. 8, was assigned to JMJ Korea Co. Ltd. (Busan, South Korea).

"Apparatus for bonding clip, method of bonding clip, and semiconductor package including semiconductor chip to which clip is bonded using the method" was invented by Yun Hwa Choi (Busan, South Korea) and Ji Won Choi (Busan, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention relates to an apparatus for bonding clips, a method of bonding clips, and a semiconductor package including semiconductor chips to which the clips are bonded using the method, and more particularly, to an apparatus for bonding clips, a method of bonding clips, and a semi...