US Patent Issued to Qorvo US on Sept. 8 for "Multichip module thermal management through backside metal" (Texas, North Carolina Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,519, issued on Sept. 8, was assigned to Qorvo US Inc. (Greensboro, N.C.).

"Multichip module thermal management through backside metal" was invented by MD Hasnine (Richardson, Texas), Mark C. Woods (Richardson, Texas), Neftali Salazar (Oak Ridge, N.C.), Smreeti Dahariya (Chapel Hill, N.C.) and Christine Blair (Lewisville, Texas).

According to the abstract* released by the U.S. Patent & Trademark Office: "Multichip module thermal management through backside metal systems and methods are disclosed. In one aspect, a multichip module includes one or more flip chip integrated circuits (ICs), each having a backside to which a metal heat conductor or spreader is attached. The presence of...