US Patent Issued to STMicroelectronics (Grenoble 2) on Sept. 8 for "Electronic device with thermally coupled contact pads via multi-tooth metal interface" (French Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,521, issued on Sept. 8, was assigned to STMicroelectronics (Grenoble 2) SAS (Grenoble, France).

"Electronic device with thermally coupled contact pads via multi-tooth metal interface" was invented by Luc Petit (Fontaine, France), Jerome Lopez (Saint Jean de Moirans, France) and Karine Saxod (Porte de Savoie, France).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic device includes an electronic chip located between a cover and an interconnection substrate. The electronic chip has contact pads located in front of a first surface of the interconnection substrate. At least one metal region (for example extending on the front surface) thermall...