ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,438, issued on Sept. 8, was assigned to Daifuku Co. Ltd. (Osaka, Japan). "Article elevating device" was invented by Hiroshi Otsuka (Hinocho... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,439, issued on Sept. 8, was assigned to SEMES Co. Ltd. (Cheonan-si, South Korea). "Apparatus for treating substrate and method for treating... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,440, issued on Sept. 8, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "System and method for automated waf... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,441, issued on Sept. 8, was assigned to Tokyo Electron Ltd. (Tokyo). "Substrate transfer method" was invented by Nanako Shinoda (Yamanashi,... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,442, issued on Sept. 8, was assigned to Tokyo Electron Ltd. (Tokyo). "Process system, method, and substrate chuck" was invented by Matthew ... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,443, issued on Sept. 8, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Electrostatic clamp having charge control assembly" ... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,444, issued on Sept. 8, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Electrostatic chuck" was invented by Junh... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,445, issued on Sept. 8, was assigned to Beijing E-Town Semiconductor Technology Co. Ltd. (Beijing) and Mattson Technology Inc. (Fremont, Cal... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,446, issued on Sept. 8, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Cathode assembly for integration of embedded electro... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,447, issued on Sept. 8, was assigned to PVA TePla Analytical Systems GmbH (Westhausen, Germany). "Wafer chuck having multiple simultaneousl... Read More