US Patent Issued to PVA TePla Analytical Systems on Sept. 8 for "Wafer chuck having multiple simultaneously actuated wafer contact fingers for handling a wafer" (German Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,447, issued on Sept. 8, was assigned to PVA TePla Analytical Systems GmbH (Westhausen, Germany).

"Wafer chuck having multiple simultaneously actuated wafer contact fingers for handling a wafer" was invented by Peter Hoffrogge (Oberkochen, Germany) and Mario Lowack (Neuburg an der Kammel, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wafer chuck for handling a wafer that can be used in a wafer process device or in a scanning acoustic microscope. The wafter chuck having a fixing device for the wafer. Wherein the fixing device has a free space for receiving the wafer and a holder with multiple wafer contact fingers, which are movable relativ...