US Patent Issued to Beijing E-Town Semiconductor Technology, Mattson Technology on Sept. 8 for "Electrostatic chuck assembly for plasma processing apparatus" (California Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,445, issued on Sept. 8, was assigned to Beijing E-Town Semiconductor Technology Co. Ltd. (Beijing) and Mattson Technology Inc. (Fremont, Calif.).

"Electrostatic chuck assembly for plasma processing apparatus" was invented by Maolin Long (Santa Clara, Calif.) and Weimin Zeng (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electrostatic chuck including a clamping layer having a first clamping electrode and a second clamping electrode is disclosed. A first clamping electrode defining a first clamping zone and a second clamping zone is provided. The first clamping zone and the second clamping zone are separated by a first gap and are...