ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,243, issued on Sept. 8, was assigned to Renesas Electronics Corp. (Tokyo). "Semiconductor device and method of manufacturing the same" was ... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,244, issued on Sept. 8, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Method of manufacturing a semicondu... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,245, issued on Sept. 8, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Forksheet field effect transistor including ... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,247, issued on Sept. 8, was assigned to Mitsubishi Electric Corp. (Tokyo). "Semiconductor device including a FWD region formed on a substra... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,248, issued on Sept. 8, was assigned to Intel Corp. (Santa Clara, Calif.). "Gate link across gate cut in semiconductor devices" was invente... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,249, issued on Sept. 8, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor device including a plurality o... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,250, issued on Sept. 8, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsin-Chu, Taiwan). "FinFET with first fin on top o... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,251, issued on Sept. 8, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING Co. LTD. (Hsinchu, Taiwan). "Semiconductor device and method" wa... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,252, issued on Sept. 8, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Gate contacts for semiconductor devices" was... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,253, issued on Sept. 8, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Semiconductor device and fabric... Read More