US Patent Issued to Applied Materials on Sept. 8 for "Cassette structures and related methods for batch processing in epitaxial deposition operations" (American, Indian Inventors)

Posted On: 2026-09-08

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,452, issued on Sept. 8, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Cassette structures and related methods for batch pr... Read More

US Patent Issued to Applied Materials on Sept. 8 for "Susceptor assembly thermal break and methods for cooling a susceptor assembly" (Indian, American Inventors)

Posted On: 2026-09-08

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ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,453, issued on Sept. 8, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Susceptor assembly thermal break and methods for coo... Read More

US Patent Issued to United Semiconductor (Xiamen) on Sept. 8 for "Method for detecting back surface of wafer" (Singaporean, Chinese, Taiwanese Inventors)

Posted On: 2026-09-08

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ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,454, issued on Sept. 8, was assigned to United Semiconductor (Xiamen) Co. Ltd. (Xiamen, China). "Method for detecting back surface of wafer... Read More

US Patent Issued to Yamaha Robotics on Sept. 8 for "Inspection device, mounting apparatus, inspection method, and non-transitory computer readable recording medium" (Japanese Inventor)

Posted On: 2026-09-08

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ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,455, issued on Sept. 8, was assigned to Yamaha Robotics Co. Ltd. (Tokyo). "Inspection device, mounting apparatus, inspection method, and no... Read More

US Patent Issued to HAMAMATSU PHOTONICS on Sept. 8 for "Manufacturing method, inspection method, and inspection device" (Japanese Inventor)

Posted On: 2026-09-08

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ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,456, issued on Sept. 8, was assigned to HAMAMATSU PHOTONICS K.K. (Hamamatsu, Japan). "Manufacturing method, inspection method, and inspecti... Read More

US Patent Issued to Tokyo Electron on Sept. 8 for "Systems and methods that use infrared (IR) spectroscopy to monitor process chemicals utilized in a semiconductor process" (Texas, New York Inventors)

Posted On: 2026-09-08

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ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,457, issued on Sept. 8, was assigned to Tokyo Electron Ltd. (Tokyo). "Systems and methods that use infrared (IR) spectroscopy to monitor pr... Read More

US Patent Issued to Infineon Technologies on Sept. 8 for "Semiconductor device with termination structure and field-free region" (German Inventors)

Posted On: 2026-09-08

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ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,458, issued on Sept. 8, was assigned to Infineon Technologies AG (Neubiberg, Germany). "Semiconductor device with termination structure and... Read More

US Patent Issued to CHANGXIN MEMORY TECHNOLOGIES on Sept. 8 for "Package structure having a semiconductor functional structure and redistribution layers (RDLs)" (Chinese Inventors)

Posted On: 2026-09-08

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ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,459, issued on Sept. 8, was assigned to CHANGXIN MEMORY TECHNOLOGIES INC. (Hefei City, China). "Package structure having a semiconductor fu... Read More

US Patent Issued to SAMSUNG ELECTRONICS on Sept. 8 for "Substrate including test circuit and substrate test apparatus including the substrate" (South Korean Inventors)

Posted On: 2026-09-08

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ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,460, issued on Sept. 8, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Substrate including test circuit and subs... Read More

US Patent Issued to DENSO, TOYOTA JIDOSHA, MIRISE Technologies, National University Corporation Tokai National Higher Education and Research System, HAMAMATSU PHOTONICS on Sept. 8 for "Semiconductor wafer processing apparatus and method of manufacturing semiconductor element" (Japanese Inventors)

Posted On: 2026-09-08

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ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,461, issued on Sept. 8, was assigned to DENSO Corp. (Kariya-city, Japan), TOYOTA JIDOSHA K.K. (Toyota, Japan), MIRISE Technologies Corp. (Ni... Read More

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US Patent Issued to Applied Materials on Sept. 8 for "Cassette structures and related methods for batch processing in epitaxial deposition operations" (American, Indian Inventors)

US Patent Issued to Applied Materials on Sept. 8 for "Susceptor assembly thermal break and methods for cooling a susceptor assembly" (Indian, American Inventors)

US Patent Issued to United Semiconductor (Xiamen) on Sept. 8 for "Method for detecting back surface of wafer" (Singaporean, Chinese, Taiwanese Inventors)

US Patent Issued to Yamaha Robotics on Sept. 8 for "Inspection device, mounting apparatus, inspection method, and non-transitory computer readable recording medium" (Japanese Inventor)

US Patent Issued to HAMAMATSU PHOTONICS on Sept. 8 for "Manufacturing method, inspection method, and inspection device" (Japanese Inventor)

US Patent Issued to Tokyo Electron on Sept. 8 for "Systems and methods that use infrared (IR) spectroscopy to monitor process chemicals utilized in a semiconductor process" (Texas, New York Inventors)

US Patent Issued to Infineon Technologies on Sept. 8 for "Semiconductor device with termination structure and field-free region" (German Inventors)

US Patent Issued to CHANGXIN MEMORY TECHNOLOGIES on Sept. 8 for "Package structure having a semiconductor functional structure and redistribution layers (RDLs)" (Chinese Inventors)

US Patent Issued to SAMSUNG ELECTRONICS on Sept. 8 for "Substrate including test circuit and substrate test apparatus including the substrate" (South Korean Inventors)

US Patent Issued to DENSO, TOYOTA JIDOSHA, MIRISE Technologies, National University Corporation Tokai National Higher Education and Research System, HAMAMATSU PHOTONICS on Sept. 8 for "Semiconductor wafer processing apparatus and method of manufacturing semiconductor element" (Japanese Inventors)