ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,442, issued on Sept. 8, was assigned to Tokyo Electron Ltd. (Tokyo). "Process system, method, and substrate chuck" was invented by Matthew ... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,443, issued on Sept. 8, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Electrostatic clamp having charge control assembly" ... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,444, issued on Sept. 8, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Electrostatic chuck" was invented by Junh... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,445, issued on Sept. 8, was assigned to Beijing E-Town Semiconductor Technology Co. Ltd. (Beijing) and Mattson Technology Inc. (Fremont, Cal... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,446, issued on Sept. 8, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Cathode assembly for integration of embedded electro... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,447, issued on Sept. 8, was assigned to PVA TePla Analytical Systems GmbH (Westhausen, Germany). "Wafer chuck having multiple simultaneousl... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,448, issued on Sept. 8, was assigned to LAM RESEARCH AG (Villach, Austria). "Apparatus for processing a wafer" was invented by Michael Brug... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,449, issued on Sept. 8, was assigned to VAT Holding AG (Haag, Switzerland). "Pin lifting device" was invented by Michael Dur (Hohenweiler, ... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,450, issued on Sept. 8, was assigned to Tokyo Electron Ltd. (Tokyo). "Multi-material chuck" was invented by Christopher Netzband (Albany, N... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,451, issued on Sept. 8, was assigned to SCREEN Holdings Co. Ltd. (Kyoto, Japan). "Substrate processing apparatus" was invented by Shinichi ... Read More