US Patent Issued to ESA Elektroschaltanlagen Grimma on May 26 for "Method and device for insulation monitoring and insulation fault location for unearthed power supply networks" (German Inventor)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,638,488, issued on May 26, was assigned to ESA Elektroschaltanlagen Grimma GmbH (Germany). "Method and device for insulation monitoring and insu... Read More

US Patent Issued to Hitachi Astemo on May 26 for "Communication device, communication system, and communication method" (Japanese Inventors)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,638,489, issued on May 26, was assigned to Hitachi Astemo Ltd. (Hitachinaka, Japan). "Communication device, communication system, and communicat... Read More

US Patent Issued to GM GLOBAL TECHNOLOGY OPERATIONS on May 26 for "Integrated insulation inspection system including insulation inspection stand with conductive brushes" (Michigan Inventors)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,638,490, issued on May 26, was assigned to GM GLOBAL TECHNOLOGY OPERATIONS LLC (Detroit). "Integrated insulation inspection system including ins... Read More

US Patent Issued to SAMSUNG ELECTRONICS on May 26 for "Semiconductor package and method of testing the same" (South Korean Inventors)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,638,492, issued on May 26, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package and method of testing th... Read More

US Patent Issued to TEXAS INSTRUMENTS on May 26 for "Temperature compensation for a current sense circuit" (Indian Inventors)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,638,493, issued on May 26, was assigned to TEXAS INSTRUMENTS Inc. (Dallas). "Temperature compensation for a current sense circuit" was invented ... Read More

US Patent Issued to Tokyo Electron on May 26 for "Testing device and method, and non-transitory computer-readable recording medium" (Japanese Inventors)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,638,494, issued on May 26, was assigned to Tokyo Electron Ltd. (Tokyo). "Testing device and method, and non-transitory computer-readable recordi... Read More

US Patent Issued to Ciena on May 26 for "Fixturing assembly and method for testing, calibrating, and validating high speed radio frequency signals on flexible printed circuits" (Canadian Inventors)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,638,495, issued on May 26, was assigned to Ciena Corp. (Hanover, Md.). "Fixturing assembly and method for testing, calibrating, and validating h... Read More

US Patent Issued on May 26 for "Electronics part verification system" (California Inventors)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,638,496, issued on May 26. "Electronics part verification system" was invented by Shahab Jafri (Fremont, Calif.) and Kazim Jafri (Fremont, Calif... Read More

US Patent Issued to XINGR TECHNOLOGIES (ZHEJIANG) on May 26 for "Method of having good thermal isolation in wafer test cassette" (Singaporean, Taiwanese Inventors)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,638,497, issued on May 26, was assigned to XINGR TECHNOLOGIES (ZHEJIANG) Ltd. (Yiwu City, China). "Method of having good thermal isolation in wa... Read More

US Patent Issued to SAMSUNG ELECTRONICS on May 26 for "Semiconductor wafer test system by feedback control" (South Korean Inventors)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,638,498, issued on May 26, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor wafer test system by feedback co... Read More

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