US Patent Issued to SAMSUNG ELECTRONICS on May 26 for "Semiconductor package and method of testing the same" (South Korean Inventors)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,638,492, issued on May 26, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package and method of testing the same" was invented by Seunghyun Cho (Cheonan-si, South Korea), Kwanjai Lee (Yongin-si, South Korea), Jae-Min Jung (Seoul, South Korea), Jeong-Kyu Ha (Hwaseong-si, South Korea) and Sang-Uk Han (Asan-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a base film having a first mount section, a first folding section, a second folding section, and a second mount section. A first semiconductor chip is disposed on the first mount section of the base film. A second semicond...