US Patent Issued to XINGR TECHNOLOGIES (ZHEJIANG) on May 26 for "Method of having good thermal isolation in wafer test cassette" (Singaporean, Taiwanese Inventors)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,638,497, issued on May 26, was assigned to XINGR TECHNOLOGIES (ZHEJIANG) Ltd. (Yiwu City, China).

"Method of having good thermal isolation in wafer test cassette" was invented by Choon Leong Lou (Singapore) and Ho Yeh Chen (Zhubei City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wafer test cassette having a fluid inlet and a fluid outlet, includes a first housing, a second housing, a heat source, and an isolation device. The first housing includes a probe card including probes. The second housing is coupled to the first housing, so that a test space is defined. The second housing carries a wafer arranged in the test space, and the probes are...