US Patent Issued to SAMSUNG ELECTRONICS on May 26 for "Semiconductor wafer test system by feedback control" (South Korean Inventors)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,638,498, issued on May 26, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor wafer test system by feedback control" was invented by Gibong Lee (Suwon-si, South Korea) and Sungok Yu (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wafer test system includes: a first heat source unit including a first refrigerant having a first temperature range; a second heat source unit including a second refrigerant having a second temperature range; a wafer chuck to support a wafer, which: a heating member to heat the wafer, and a channel to circulate the first refrigerant and the second refrigerant; a first sup...