US Patent Issued to Tokyo Electron on Sept. 1 for "Method for processing a substrate" (New York Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,414, issued on Sept. 1, was assigned to Tokyo Electron Ltd. (Tokyo). "Method for processing a substrate" was invented by Yen-Tien Lu (Alban... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 1 for "Stealth patterning formation for bonding improvement" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,415, issued on Sept. 1, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Stealth patterning formation for bo... Read More

US Patent Issued to Applied Materials on Sept. 1 for "Processes to deposit amorphous-silicon etch protection liner" (California Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,416, issued on Sept. 1, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Processes to deposit amorphous-silicon etch protecti... Read More

US Patent Issued to SUMCO on Sept. 1 for "Wafer polishing method and silicon wafer" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,417, issued on Sept. 1, was assigned to SUMCO Corp. (Tokyo). "Wafer polishing method and silicon wafer" was invented by Kazuaki Kozasa (Tok... Read More

US Patent Issued to UTAC HEADQUARTERS on Sept. 1 for "Plasma diced wafers and methods thereof" (Singaporean Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,418, issued on Sept. 1, was assigned to UTAC HEADQUARTERS PTE. LTD. (Singapore). "Plasma diced wafers and methods thereof" was invented by ... Read More

US Patent Issued to DISCO on Sept. 1 for "Wafer processing method" (Japanese Inventor)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,419, issued on Sept. 1, was assigned to DISCO Corp. (Tokyo). "Wafer processing method" was invented by Kazuma Sekiya (Tokyo). According to... Read More

US Patent Issued to WONIK QNC on Sept. 1 for "Method and apparatus for dry-cleaning AlN heater for semiconductor fabrication equipment" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,420, issued on Sept. 1, was assigned to WONIK QNC Corp. (Gumi-si, South Korea). "Method and apparatus for dry-cleaning AlN heater for semic... Read More

US Patent Issued to SEMES on Sept. 1 for "Substrate processing apparatus and substrate processing method" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,421, issued on Sept. 1, was assigned to SEMES Co. LTD. (Chungcheongnam-Do, South Korea). "Substrate processing apparatus and substrate proc... Read More

US Patent Issued to KURITA WATER INDUSTRIES on Sept. 1 for "Wafer cleaning water supply system and wafer cleaning water supply method" (Japanese Inventor)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,422, issued on Sept. 1, was assigned to KURITA WATER INDUSTRIES LTD. (Tokyo). "Wafer cleaning water supply system and wafer cleaning water ... Read More

US Patent Issued to SCREEN HOLDINGS on Sept. 1 for "Substrate processing apparatus" (Japanese Inventor)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,423, issued on Sept. 1, was assigned to SCREEN HOLDINGS Co. LTD. (Japan). "Substrate processing apparatus" was invented by Shuhei Nemoto (K... Read More

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