US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 1 for "Stealth patterning formation for bonding improvement" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,415, issued on Sept. 1, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Stealth patterning formation for bonding improvement" was invented by Ming-Tsu Chung (Hsinchu, Taiwan), Yung-Chi Lin (Su-Lin City, Taiwan) and Yen-Ming Chen (Chu-Pei City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes forming a patterned treating mask over a first surface dielectric layer of a first package component, wherein portions of the first surface dielectric layer are exposed through the patterned treating mask, performing a selective plasma treatment on the portions of the first surface dielectric layer that are ...