ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,012, issued on April 7, was assigned to Hitachi Energy Ltd (Zurich). "Free configurable power semiconductor module" was invented by Juergen... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,013, issued on April 7, was assigned to Intel Corp. (Santa Clara, Calif.). "Semiconductor packages for stacked memory-on-package (SMOP) and... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,014, issued on April 7, was assigned to POWERTECH TECHNOLOGY INC. (Hsinchu County, Taiwan). "Package device and manufacturing method thereo... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,015, issued on April 7, was assigned to Hyundai Motor Co. (Seoul, South Korea) and Kia Corp. (Seoul, South Korea). "Power module for vehicl... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,016, issued on April 7, was assigned to Dell Products LP (Round Rock, Texas). "Flip chip package" was invented by Qinghong He (Austin, Texa... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,017, issued on April 7, was assigned to LG INNOTEK Co. LTD. (Seoul, South Korea). "Package substrate" was invented by Nam Heon Kim (Seoul, ... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,018, issued on April 7, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Package structure with enhancement ... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,019, issued on April 7, was assigned to Zhuhai ACCESS Semiconductor Co. Ltd. (Guangdong, China). "Embedded packaging structure and manufact... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,020, issued on April 7, was assigned to Kulicke and Soffa Industries Inc. (Fort Washington, Pa.). "Electronic component bonding machines, a... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,021, issued on April 7, was assigned to Altera Corp. (San Jose, Calif.). "Homogenous die stacking with increased element density" was inven... Read More