ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,968, issued on April 7, was assigned to ASM IP Holding B.V. (Almere, Netherlands). "Method of forming patterned structures" was invented by... और पढ़ें
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,969, issued on April 7, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Flexible monomer for smooth polymer surface" was inv... और पढ़ें
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,970, issued on April 7, was assigned to INTERNATIONAL BUSINESS MACHINES Corp. (Armonk, N.Y.). "Top via on subtractively etched conductive l... और पढ़ें
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,971, issued on April 7, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Conductive via with improved ga... और पढ़ें
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,972, issued on April 7, was assigned to Micron Technology Inc. (Boise, Idaho). "Methods used in forming a memory array comprising strings o... और पढ़ें
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,973, issued on April 7, was assigned to Micron Technology Inc. (Boise, Idaho). "Microelectronic devices, and related memory devices, electr... और पढ़ें
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,974, issued on April 7, was assigned to XINTEC INC. (Taoyuan City, Taiwan). "Chip package and manufacturing method thereof" was invented by... और पढ़ें
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,975, issued on April 7, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Integrated circuit device" was invented by J... और पढ़ें
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,976, issued on April 7, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Semiconductor device" was invented by Jeo... और पढ़ें
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,977, issued on April 7, was assigned to Intel Corp. (Santa Clara, Calif.). "Fill of vias in single and dual damascene structures using self... और पढ़ें