ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,974, issued on April 7, was assigned to XINTEC INC. (Taoyuan City, Taiwan).
"Chip package and manufacturing method thereof" was invented by Ching-Ting Peng (Taoyuan City, Taiwan), Sheng-Hsiang Fu (Taoyuan City, Taiwan) and Hsin-Yi Chen (Taoyuan City, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A chip package includes a semiconductor substrate, a conductive pad, an isolation layer, and a redistribution layer. The semiconductor substrate has a first surface, a second surface facing away from the first surface, a through hole through the first and second surfaces, and a recess in the first surface. The conductive pad is located on the second ...