ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,972, issued on June 23, was assigned to QUALCOMM TECHNOLOGIES INC. (San Diego) and RF360 SINGAPORE PTE. LTD. (Singapore). "Die package with... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,973, issued on June 23, was assigned to KIOXIA Corp. (Tokyo). "Semiconductor device, method of manufacturing semiconductor device, and meth... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,974, issued on June 23, was assigned to McMaster University (Hamilton, Canada). "Silver sintered molybdenum (SSM) packaging for power semic... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,975, issued on June 23, was assigned to ROHM Co. LTD. (Kyoto, Japan). "Semiconductor device" was invented by Kenji Fujii (Kyoto, Japan) and... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,977, issued on June 23, was assigned to Intel Corp. (Santa Clara, Calif.). "Methods, systems, apparatus, and articles of manufacture for in... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,978, issued on June 23, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Semiconductor package structure... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,979, issued on June 23, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Semiconductor package and metho... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,980, issued on June 23, was assigned to AaltoSemi Inc. (Nanjing City, China). "Substrate structure" was invented by Min-Yao Chen (Nanjing C... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,981, issued on June 23, was assigned to XILINX INC. (San Jose, Calif.). "Stress-reduced package substrate and method of forming the same" w... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,982, issued on June 23, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Semiconductor package" was invented by Jo... Read More