US Patent Issued to SAMSUNG ELECTRONICS on June 23 for "Semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,982, issued on June 23, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).

"Semiconductor package" was invented by Jong Bo Shim (Anyang-si, South Korea), Sung Bum Kim (Cheonan-si, South Korea) and Ji Hwang Kim (Cheonan-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package is provided. A semiconductor package includes a wiring structure, which includes a first insulating layer and a first wiring pad inside the first insulating layer a semiconductor chip on the wiring structure, an interposer having one surface facing the semiconductor chip and including a second insulating layer and a second wiri...