US Patent Issued to KIOXIA on June 23 for "Semiconductor device, method of manufacturing semiconductor device, and method of disposing alignment mark" (Japanese Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,973, issued on June 23, was assigned to KIOXIA Corp. (Tokyo).

"Semiconductor device, method of manufacturing semiconductor device, and method of disposing alignment mark" was invented by Susumu Yamamoto (Yokkaichi, Japan), Hideki Matsushige (Yokkaichi, Japan) and Gen Toyota (Yokkaichi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided a semiconductor device including a first chip and a second chip bonded to the first chip. The first chip includes a first alignment mark provided in a first region of a bonding surface and a plurality of first dummy pads provided in a second region of the bonding surface different from the first re...