US Patent Issued to Intel on June 23 for "Methods, systems, apparatus, and articles of manufacture for integrated circuit package substrates with high aspect ratio through glass vias" (Oregon, Arizona Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,977, issued on June 23, was assigned to Intel Corp. (Santa Clara, Calif.).

"Methods, systems, apparatus, and articles of manufacture for integrated circuit package substrates with high aspect ratio through glass vias" was invented by Veronica Strong (Hillsboro, Ore.), Aleksandar Aleksov (Chandler, Ariz.), Georgios Dogiamis (Chandler, Ariz.), Telesphor Kamgaing (Chandler, Ariz.), Neelam Prabhu Gaunkar (Chandler, Ariz.) and Brandon Rawlings (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Methods, systems, apparatus, and articles of manufacture are disclosed for integrated circuit package substrates with high aspect ratio through glass ...