US Patent Issued to McMaster University on June 23 for "Silver sintered molybdenum (SSM) packaging for power semiconductor devices" (Canadian Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,974, issued on June 23, was assigned to McMaster University (Hamilton, Canada).

"Silver sintered molybdenum (SSM) packaging for power semiconductor devices" was invented by Yuhang Yang (Hamilton, Canada) and Ali Emadi (Burlington, Canada).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure generally relates to a silver sintered molybdenum (SSM) packaging for power semiconductor devices and a method of manufacturing thereof. The SSM packaging comprises a substrate; a MOSFET die comprising a first side and a second side, wherein the first side is bonded to the substrate using nano silver sintering; and at least two leads connected, at...