ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,870, issued on Nov. 3, was assigned to Advanced Semiconductor Engineering Inc. (Kaohsiung, Taiwan). "Electronic device" was invented by Syu-... और पढ़ें
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,871, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package" was invented by Nara Le... और पढ़ें
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,873, issued on Nov. 3, was assigned to ROHM Co. LTD. (Kyoto, Japan). "Semiconductor device" was invented by Hiroto Sakai (Kyoto, Japan), Yut... और पढ़ें
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,874, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor package" was invented by Wonjung... और पढ़ें
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,875, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package" was invented by Dongkyu... और पढ़ें
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,876, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Display module including bonding member connec... और पढ़ें
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,877, issued on Nov. 3, was assigned to XIAMEN EXTREMELY PQ DISPLAY TECHNOLOGY Co. LTD. (Xiamen, China). "Micro light emitting diode chip and... और पढ़ें
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,878, issued on Nov. 3, was assigned to QUALCOMM Inc. (San Diego). "Stacked integrated circuit devices" was invented by Yue Li (San Diego), R... और पढ़ें
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,879, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Semiconductor chip and semiconductor packag... और पढ़ें
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,880, issued on Nov. 3, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Dual-side bridge chips connecting two semicond... और पढ़ें