US Patent Issued to ROHM on Nov. 3 for "Semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,873, issued on Nov. 3, was assigned to ROHM Co. LTD. (Kyoto, Japan).

"Semiconductor device" was invented by Hiroto Sakai (Kyoto, Japan), Yuta Okawauchi (Kyoto, Japan), Takukazu Otsuka (Kyoto, Japan) and Ken Nakahara (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes: a substrate having an obverse surface; a first wiring layer on the obverse surface; a second wiring layer on the obverse surface, separated from the first wiring layer; a first semiconductor element having mutually opposite first obverse electrode and first reverse electrode, with the first reverse electrode bonded to the first wiring layer; a se...