ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,764, issued on Nov. 3, was assigned to SILICONWARE PRECISION INDUSTRIES Co. LTD. (Taichung City, Taiwan). "Electronic package and manufactur... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,765, issued on Nov. 3, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Package structure including heat sink structure an... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,766, issued on Nov. 3, was assigned to AMD DESIGN LLC (Wilmington, Del.). "Heat sink with heat pipe handle portion" was invented by Sruti Ch... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,767, issued on Nov. 3, was assigned to DENSO International America Inc. (Southfield, Mich.) and DENSO Corp. (Kariya-city, Japan). "Emitters ... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,768, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor packaging having thermal interfa... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,769, issued on Nov. 3, was assigned to ARIECA INC. (Pittsburgh). "Method of manufacture of a thermal interface material, a thermal interface... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,770, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package and method of fabricatin... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,771, issued on Nov. 3, was assigned to AMOSENSE Co. LTD. (Cheonan-si, South Korea). "Inverter power module" was invented by Kyungwhan Woo (C... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,772, issued on Nov. 3, was assigned to Infineon Technologies AG (Neubiberg, Germany). "Package with electrically insulating and thermally co... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,773, issued on Nov. 3. "Method for fabricating semiconductor devices using through-die laser reflow and backside thermal layer stack formati... Read More