US Patent Issued to SAMSUNG ELECTRONICS on Nov. 3 for "Semiconductor packaging having thermal interfacial material film including epoxy and liquid metal filler" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,768, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor packaging having thermal interfacial material film including epoxy and liquid metal filler" was invented by Mihyae Park (Suwon-si, South Korea) and Chiwoo Lee (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package including a first semiconductor chip and a second semiconductor chip on a first substrate, a thermal conductive adhesive layer on the first semiconductor chip and the second semiconductor chip and including a resin layer, the resin layer including a first heat dissipation filler, the first heat d...