US Patent Issued to ARIECA on Nov. 3 for "Method of manufacture of a thermal interface material, a thermal interface material formed therefrom, and an integrated circuit formed therefrom" (Pennsylvania, Connecticut Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,769, issued on Nov. 3, was assigned to ARIECA INC. (Pittsburgh).

"Method of manufacture of a thermal interface material, a thermal interface material formed therefrom, and an integrated circuit formed therefrom" was invented by Navid Kazem (Pittsburgh), Jeffrey Gelorme (Burlington, Conn.), Keyton D. Feller (Pittsburgh) and Allyssa Kerr (Pittsburgh).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacture of a thermal interface material, a thermal interface material formed therefrom, and an integrated circuit formed therefrom are provided. The method includes distilling a first polymer component to form a distilled polymer component. The ...