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US Patent Issued to DENSO on Nov. 3 for "Semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,782, issued on Nov. 3, was assigned to DENSO Corp. (Kariya-city, Japan). "Semiconductor device" was invented by Yoichi Sasaki (Kariya-city, ... Read More


US Patent Issued to X-Celeprint on Nov. 3 for "Micro-transfer-printable component modules with a module tether and micro-component on a flexible, polymer, or organic module substrate" (Irish, American Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,783, issued on Nov. 3, was assigned to X-Celeprint Ltd. (Dublin). "Micro-transfer-printable component modules with a module tether and micro... Read More


US Patent Issued to GlobalFoundries U.S. on Nov. 3 for "Structure including moisture barrier along input/output opening and related method" (New York Inventor)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,784, issued on Nov. 3, was assigned to GlobalFoundries U.S. Inc. (Malta, N.Y.). "Structure including moisture barrier along input/output ope... Read More


US Patent Issued to HUNAN SAN'AN SEMICONDUCTOR on Nov. 3 for "Semiconductor device and method of making the same and seal ring structure" (Chinese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,785, issued on Nov. 3, was assigned to HUNAN SAN'AN SEMICONDUCTOR Co. LTD. (Changsha, China). "Semiconductor device and method of making the... Read More


US Patent Issued to Samsung Display on Nov. 3 for "Chip on film package" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,786, issued on Nov. 3, was assigned to Samsung Display Co. Ltd. (Yongin-si, South Korea). "Chip on film package" was invented by Wontae Kim ... Read More


US Patent Issued to MediaTek on Nov. 3 for "Semiconductor devices with in-package PGS for coupling noise suppression" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,787, issued on Nov. 3, was assigned to MediaTek Inc. (Hsinchu City, Taiwan). "Semiconductor devices with in-package PGS for coupling noise s... Read More


US Patent Issued to KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY on Nov. 3 for "Security code including metamaterials" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,789, issued on Nov. 3, was assigned to KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY (Seoul, South Korea). "Security code including metamaterial... Read More


US Patent Issued to SAMSUNG ELECTRONICS on Nov. 3 for "Semiconductor package having an antenna pattern on a mold layer" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,790, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package having an antenna patter... Read More


US Patent Issued to STATS ChipPAC on Nov. 3 for "Semiconductor device and method of forming selective shielding using UV curable ink" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,791, issued on Nov. 3, was assigned to STATS ChipPAC Pte. Ltd. (Singapore). "Semiconductor device and method of forming selective shielding ... Read More


US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Nov. 3 for "Transmission line structure with protruding sub-lines and dielectric material zones for RF signal" (Taiwanese Inventor)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,792, issued on Nov. 3, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Transmission line structure with ... Read More