US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Nov. 3 for "Transmission line structure with protruding sub-lines and dielectric material zones for RF signal" (Taiwanese Inventor)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,792, issued on Nov. 3, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Transmission line structure with protruding sub-lines and dielectric material zones for RF signal" was invented by Hsiu-Ying Cho (Hsin Chu City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Transmission line structures are provided. The first and second conductive lines extend in a first direction. The first transmission line includes a first sub-line extending in the first direction and second sub-lines extending toward the first conductive line. The second sub-lines include first, second, and third groups. The first dielectric materia...